Young-Chang Joo
According to our database1,
Young-Chang Joo
authored at least 5 papers
between 2008 and 2018.
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Bibliography
2018
Computational paper wrapping transforms non-stretchable 2D devices into wearable and conformable 3D devices.
CoRR, 2018
Super Compaction and Pluripotent Shape Transformation via Algorithmic Stacking for 3D Deployable Structures.
CoRR, 2018
Successive breakdown mode of time-dependent dielectric breakdown for Cu interconnects and lifetime enhancement under dynamic bias stress.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
2011
Electrical Reliability of Cu/Sn Micro-bump in Wafer Level Packaging for BioMEMS Devices.
Proceedings of the BIODEVICES 2011, 2011
2008
The self-formatting barrier characteristics of Cu-Mg/SiO<sub>2</sub> and Cu-Ru/SiO<sub>2</sub> films for Cu interconnects.
Microelectron. Reliab., 2008