Carsten Schäffer

According to our database, Carsten Schäffer authored at least 2 papers between 2014 and 2016.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2016

Reliability aspects of copper metallization and interconnect technology for power devices.

Frank Hille, Roman Roth, Carsten Schäffer, Holger Schulze, Nicolas Heuck, Daniel Bolowski, Karsten Guth, Alexander Ciliox, Karina Rott, Frank Umbach, Martin Kerber

Microelectron. Reliab., 2016

2014

Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti.

Michael Fugger, Mathias Plappert, Carsten Schäffer, Oliver Humbel, Herbert Hutter, Herbert Danninger, Mathias Nowottnick

Microelectron. Reliab., 2014