Changkun Park

Orcid: 0000-0002-4699-9935

According to our database1, Changkun Park authored at least 14 papers between 2013 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2024
Asymmetric SOI CMOS Switch With Series and Parallel Resonators to Enhance Isolation.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024

Ka-Band Three-Stacked CMOS Power Amplifier With LC Shunt-Feedback to Enhance Gain and Stability.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024

Ka-Band CMOS Power Amplifier Using Stacked Structure With Cascode-Like Operation.
IEEE Trans. Circuits Syst. II Express Briefs, April, 2024

2023
A Ka-Band 3-Bit GaN Digital Step Attenuator Using Phase Compensation Method.
IEEE Access, 2023

Design of CMOS-Based Unit Channel of Beamforming Transceivers for FACS Applications.
IEEE Access, 2023

2020
Wireless Transceiver for Three-Dimensional Integrated Circuits Using a Ring Oscillator.
J. Circuits Syst. Comput., 2020

2018
A 2.4-GHz VCO using a symmetric layout technique to minimize mismatches in differential signals.
Proceedings of the 2018 International Conference on Information Networking, 2018

2017
Transceiver for Wireless Power Transfer Using a Cross-Coupled Oscillator for a Wireless On-Wafer Test.
IEEE Trans. Instrum. Meas., 2017

A Quad-Band CMOS Linear Power Amplifier for EDGE Applications Using an Anti-Phase Method to Enhance its Linearity.
IEEE Trans. Circuits Syst. I Regul. Pap., 2017

A CMOS power amplifier using an active balun as a driver stage to enhance its gain.
Microelectron. J., 2017

Cell-Based ESD Diodes with a Zigzag-Shaped Layout to Enhance the ESD Survival Level.
J. Circuits Syst. Comput., 2017

Cost-effective 97%-efficiency charge-pump voltage balancer for multi-level PWM photovoltaic micro-inverter.
IEICE Electron. Express, 2017

2015
Study of stability problems due to undesired coupling of a RF power amplifier using a distributed active transformer.
Microelectron. J., 2015

2013
Transceiver with inductive coupling for wireless chip-to-chip communication using a 50-nm digital CMOS process.
Microelectron. J., 2013


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