Chau-Jie Zhan

According to our database1, Chau-Jie Zhan authored at least 3 papers between 2008 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2013
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps.
Microelectronics Reliability, 2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2008
Influence of underfill materials on the reliability of coreless flip chip package.
Microelectronics Reliability, 2008


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