According to our database1, Chau-Jie Zhan
Legend:Book In proceedings Article PhD thesis Other
Analysis of bump resistance and current distribution of ultra-fine-pitch microbumps.
Microelectronics Reliability, 2013
Performance and process characteristic of glass interposer with through-glass-via(TGV).
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Influence of underfill materials on the reliability of coreless flip chip package.
Microelectronics Reliability, 2008