Chun-Hsien Chien

According to our database1, Chun-Hsien Chien authored at least 2 papers in 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

On csauthors.net:

Bibliography

2013
Performance and process characteristic of glass interposer with through-glass-via(TGV).
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013


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