Cheng-Ta Ko

According to our database, Cheng-Ta Ko authored at least 7 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Reliability of key technologies in 3D integration.

Cheng-Ta Ko, Kuan-Neng Chen

Microelectron. Reliab., 2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Low temperature bonding technology for 3D integration.

Cheng-Ta Ko, Kuan-Neng Chen

Microelectron. Reliab., 2012

2011

Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies.

Cheng-Ta Ko, Zhi-Cheng Hsiao, Y. J. Chang, Peng-Shu Chen, J. H. Huang, Hsin-Chia Fu, Y. J. Huang, C. W. Chiang, W. L. Tsat, Y. H. Chen, Wei-Chung Lo, Kuan-Neng Chen

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Cu-based bonding technology for 3D integration applications.

Kuan-Neng Chen, Z. Xu, Fei Liu, Cheng-Ta Ko, Chuan-An Cheng, W. C. Huang, H. L. Lin, C. Cabral, Zhi-Cheng Hsiao, N. Klymko, Hsin-Chia Fu, Y. H. Chen, Jian-Qiang Lu, Wei-Chung Lo

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Wafer-level bonding/stacking technology for 3D integration.

Cheng-Ta Ko, Kuan-Neng Chen

Microelectron. Reliab., 2010

Wafer-level 3D integration using hybrid bonding.

Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen

Proceedings of the IEEE International Conference on 3D System Integration, 2010