Chia-Tai Kuo

According to our database, Chia-Tai Kuo authored at least 2 papers between 2004 and 2006.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2006

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.

Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang

Microelectron. Reliab., 2006

2004

Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application.

Chia-Tai Kuo, Ming-Chuen Yip, Kuo-Ning Chiang

Microelectron. Reliab., 2004