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Kuo-Ning Chiang

Orcid: 0000-0003-0984-0164

According to our database1, Kuo-Ning Chiang authored at least 16 papers between 2003 and 2016.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Awards

IEEE Fellow

IEEE Fellow 2013, "For contributions to design and reliability of electronic packaging".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2016
Characterization on acceleration-factor equation for packaging-solder joint reliability.
[BibTeX]
[DOI]
K.-C. Wu
,
Kuo-Ning Chiang
Microelectron. Reliab., 2016

2012
Light degradation test and design of thermal performance for high-power light-emitting diodes.
[BibTeX]
[DOI]
Yen-Fu Su
,
Shin-Yueh Yang
,
Tuan-Yu Hung
,
Chang-Chun Lee
,
Kuo-Ning Chiang
Microelectron. Reliab., 2012

2011
Thermal-mechanical behavior of the bonding wire for a power module subjected to the power cycling test.
[BibTeX]
[DOI]
T. Y. Hung
,
S. Y. Chiang
,
C. J. Huang
,
C. C. Lee
,
Kuo-Ning Chiang
Microelectron. Reliab., 2011

Measurement and simulation of interfacial adhesion strength between SiO<sub>2</sub> thin film and III-V material.
[BibTeX]
[DOI]
Tsung-Lin Chou
,
Shin-Yueh Yang
,
Chung-Jung Wu
,
Cheng-Nan Han
,
Kuo-Ning Chiang
Microelectron. Reliab., 2011

2009
Fabrication process simulation and reliability improvement of high-brightness LEDs.
[BibTeX]
[DOI]
Tsung-Lin Chou
,
Chien-Fu Huang
,
Cheng-Nan Han
,
Shin-Yueh Yang
,
Kuo-Ning Chiang
Microelectron. Reliab., 2009

2008
The mechanical stress resistance capability of stress buffer structures in analog devices.
[BibTeX]
[DOI]
Hsiao-Tung Ku
,
Kuo-Ning Chiang
Microelectron. Reliab., 2008

Solder joint and trace line failure simulation and experimental validation of fan-out type wafer level packaging subjected to drop impact.
[BibTeX]
[DOI]
Chan-Yen Chou
,
Tuan-Yu Hung
,
Shin-Yueh Yang
,
Ming-Chih Yew
,
Wen-Kun Yang
,
Kuo-Ning Chiang
Microelectron. Reliab., 2008

2007
Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis.
[BibTeX]
[DOI]
Ming-Chih Yew
,
Chan-Yen Chou
,
Kuo-Ning Chiang
Microelectron. Reliab., 2007

Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.
[BibTeX]
[DOI]
Chang-Chun Lee
,
Chien-Chen Lee
,
Hsiao-Tung Ku
,
Shu-Ming Chang
,
Kuo-Ning Chiang
Microelectron. Reliab., 2007

Reliability of interfacial adhesion in a multi-level copper/low-k interconnect structure.
[BibTeX]
[DOI]
C. C. Chiu
,
H. H. Chang
,
C. C. Lee
,
C. C. Hsia
,
Kuo-Ning Chiang
Microelectron. Reliab., 2007

2006
The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis.
[BibTeX]
[DOI]
Ming-Chih Yew
,
C. Y. Chou
,
C. S. Huang
,
W. K. Yang
,
Kuo-Ning Chiang
Microelectron. Reliab., 2006

Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip.
[BibTeX]
[DOI]
Chih-Tang Peng
,
Chia-Tai Kuo
,
Kuo-Ning Chiang
,
Terry Ku
,
Kenny Chang
Microelectron. Reliab., 2006

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.
[BibTeX]
[DOI]
Kuo-Ming Chen
,
J. D. Wu
,
Kuo-Ning Chiang
Microelectron. Reliab., 2006

Thermal resistance analysis and validation of flip chip PBGA packages.
[BibTeX]
[DOI]
Kuo-Ming Chen
,
Kuo-Hsiung Houng
,
Kuo-Ning Chiang
Microelectron. Reliab., 2006

2004
Time and temperature-dependent mechanical behavior of underfill materials in electronic packaging application.
[BibTeX]
[DOI]
Chia-Tai Kuo
,
Ming-Chuen Yip
,
Kuo-Ning Chiang
Microelectron. Reliab., 2004

2003
Impact of probing procedure on flip chip reliability.
[BibTeX]
[DOI]
Kuo-Ming Chen
,
Kuo-Ning Chiang
Microelectron. Reliab., 2003


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