D. S. Jiang

According to our database, D. S. Jiang authored at least 1 paper in 2006.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2006

Effects of underfill materials on the reliability of low-K flip-chip packaging.

K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai

Microelectron. Reliab., 2006