J. Y. Lai

According to our database, J. Y. Lai authored at least 3 papers between 2005 and 2006.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2006

An investigation into the effects of probing and wire bonding stress on the reliability of BOAC.

K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai

Microelectron. Reliab., 2006

Effects of underfill materials on the reliability of low-K flip-chip packaging.

K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai

Microelectron. Reliab., 2006

2005

Support Vector Machine Experiments for Road Recognition in High Resolution Images.

J. Y. Lai, Arcot Sowmya, John C. Trinder

Proceedings of the Machine Learning and Data Mining in Pattern Recognition, 2005