Daniel Lovell

According to our database, Daniel Lovell authored at least 2 papers between 2023 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2025

Taping Out Three Class Chips Per Semester in Intel 16 Technology.

Lucy Revina, Ethan Gao, Ken Ho, Daniel Lovell, Kristofer S. J. Pister, Borivoje Nikolic

Proceedings of the IEEE Hot Chips 37 Symposium, 2025

2023

A Heterogeneous SoC for Bluetooth LE in 28nm.

Felicia Guo, Nayiri Krzysztofowicz, Alex Moreno, Jeffrey Ni, Daniel Lovell, Yufeng Chi, Kareem Ahmad, Sherwin Afshar, Josh Alexander, Dylan Brater, Cheng Cao, Daniel Fan, Ryan Lund, Jackson Paddock, Griffin Prechter, Troy Sheldon, Shreesha Sreedhara, Anson Tsai, Eric Wu, Kerry Yu, Daniel Fritchman, Aviral Pandey, Ali Niknejad, Kristofer S. J. Pister, Borivoje Nikolic

Proceedings of the 35th IEEE Hot Chips Symposium, 2023