Daniel P. Seemuth

According to our database, Daniel P. Seemuth authored at least 3 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Flexible interconnect in 2.5D ICs to minimize the interposer's metal layers.

Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow

Proceedings of the 22nd Asia and South Pacific Design Automation Conference, 2017

2015

Automatic die placement and flexible I/O assignment in 2.5D IC design.

Daniel P. Seemuth, Azadeh Davoodi, Katherine Morrow

Proceedings of the Sixteenth International Symposium on Quality Electronic Design, 2015

2013

Automated multi-device placement, I/O voltage supply assignment, and pin assignment in circuit board design.

Daniel P. Seemuth, Katherine Morrow

Proceedings of the 2013 International Conference on Field-Programmable Technology, 2013