Daquan Yu

According to our database, Daquan Yu authored at least 9 papers between 2012 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2024

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging.

Chen Yu, Shaocheng Wu, Yi Zhong, Rongbin Xu, Tian Yu, Jin Zhao, Daquan Yu

Sensors, 2024

2022

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter.

Zuohuan Chen, Daquan Yu, Yi Zhong

Sensors, 2022

Development of a Reliable High-Performance WLP for a SAW Device.

Zuohuan Chen, Daquan Yu

Sensors, 2022

2021

A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density.

Dongfang Pan, Guolong Li, Fangting Miao, Biao Deng, Junying Wei, Daquan Yu, Ming Liu, Lin Cheng

Proceedings of the IEEE International Solid-State Circuits Conference, 2021

2020

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application.

Tianshen Zhou, Shuying Ma, Daquan Yu, Ming Li, Tao Hang

Sensors, 2020

Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate.

Xiaoli Ren, Junying Wei, Daquan Yu

Proceedings of the 2020 IEEE International Conference on Integrated Circuits, 2020

2016

Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros.

Jie Pan, Huijuan Wang, Gengxin Tian, Liqiang Cao, Daquan Yu

Microelectron. J., 2016

2014

The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer.

He Ma, Daquan Yu, Jun Wang

Microelectron. Reliab., 2014

2012

Development of reliable low temperature wafer level hermetic bonding using composite seal joint.

Daquan Yu

Microelectron. Reliab., 2012