Dave Motschman
  According to our database1,
  Dave Motschman
  authored at least 3 papers
  between 2011 and 2025.
  
  
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
  2025
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits.
    
  
    CoRR, August, 2025
    
  
  2013
Through Silicon Via Aware Design Planning for Thermally Efficient 3-D Integrated Circuits.
    
  
    IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2013
    
  
  2011
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs.
    
  
    Proceedings of the 2011 International Symposium on Low Power Electronics and Design, 2011