David A. Dillard

Orcid: 0000-0002-2903-9318

According to our database1, David A. Dillard authored at least 2 papers between 2001 and 2002.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Awards

ACM Fellow

ACM Fellow 2005, "For contributions to system verification and for leadership in the development of verifiable voting systems.".

IEEE Fellow

IEEE Fellow 2001, "For contributions to verification of circuits and systems.".

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

On csauthors.net:

Bibliography

2002
Effect of substrate flexibility on solder joint reliability.
Microelectron. Reliab., 2002

2001
Stacked solder bumping technology for improved solder joint reliability.
Microelectron. Reliab., 2001


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