David A. Dillard

According to our database, David A. Dillard authored at least 2 papers between 2001 and 2002.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2002

Effect of substrate flexibility on solder joint reliability.

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard

Microelectron. Reliab., 2002

2001

Stacked solder bumping technology for improved solder joint reliability.

Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard

Microelectron. Reliab., 2001