Edmund D. Blackshear

According to our database, Edmund D. Blackshear authored at least 2 papers between 2005 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2019

CPI Reliability Challenges of Large Flip Chip Packages and Effects of Kerf Size and Substrate.

Zhuo-Jie Wu, Manish Nayini, Charles Carey, Samantha Donovan, David Questad, Edmund D. Blackshear

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2005

The evolution of build-up package technology and its design challenges.

Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell

IBM J. Res. Dev., 2005