Jamil A. Wakil
According to our database1, Jamil A. Wakil authored at least 4 papers between 2005 and 2012.
Legend:Book In proceedings Article PhD thesis Other
Spatial and temporal thermal characterization of stacked multicore architectures.
Temperature-limited microprocessors: Measurements and design implications.
Proceedings of the 20th International Conference on VLSI Design (VLSI Design 2007), 2007
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks.
Microelectronics Reliability, 2006
The evolution of build-up package technology and its design challenges.
IBM Journal of Research and Development, 2005