Jamil A. Wakil

According to our database, Jamil A. Wakil authored at least 5 papers between 2005 and 2012.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2012

Spatial and temporal thermal characterization of stacked multicore architectures.

Eren Kursun, Jamil A. Wakil, Mukta Farooq, Robert Hannon

ACM J. Emerg. Technol. Comput. Syst., 2012

2007

Hotspot-Limited Microprocessors: Direct Temperature and Power Distribution Measurements.

Hendrik F. Hamann, Alan J. Weger, James A. Lacey, Zhigang Hu, Pradip Bose, Erwin B. Cohen, Jamil A. Wakil

IEEE J. Solid State Circuits, 2007

Temperature-limited microprocessors: Measurements and design implications.

Hendrik F. Hamann, Alan J. Weger, James A. Lacey, Zhigang Hu, Pradip Bose, Erwin B. Cohen, Jamil A. Wakil

Proceedings of the 20th International Conference on VLSI Design (VLSI Design 2007), 2007

2006

Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks.

Jamil A. Wakil

Microelectron. Reliab., 2006

2005

The evolution of build-up package technology and its design challenges.

Edmund D. Blackshear, Moises Cases, Erich Klink, Stephen R. Engle, Ronald S. Malfatt, Daniel N. deAraujo, Stefano Oggioni, Luke D. Lacroix, Jamil A. Wakil, Nam H. Pham, Gareth G. Hougham, David J. Russell

IBM J. Res. Dev., 2005