Jamil A. Wakil

According to our database1, Jamil A. Wakil
  • authored at least 4 papers between 2005 and 2012.
  • has a "Dijkstra number"2 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2012
Spatial and temporal thermal characterization of stacked multicore architectures.
JETC, 2012

2007
Temperature-limited microprocessors: Measurements and design implications.
Proceedings of the 20th International Conference on VLSI Design (VLSI Design 2007), 2007

2006
Thermal performance impacts of heat spreading lids on flip chip packages: With and without heat sinks.
Microelectronics Reliability, 2006

2005
The evolution of build-up package technology and its design challenges.
IBM Journal of Research and Development, 2005


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