Fan Yang

Orcid: 0000-0003-4831-2241

Affiliations:
  • Chongqing University, School of Electrical Engineering, State Key Laboratory of Power Transmission Equipment and System Security and New Technology, China


According to our database1, Fan Yang authored at least 13 papers between 2018 and 2023.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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Bibliography

2023
An Improved Magnetic Field Method to Locate the Grounding Conductor.
Sensors, 2023

2022
Statistical analysis of infrared thermogram for CNN-based electrical equipment identification methods.
Appl. Artif. Intell., 2022

2021
A Smart Thermography Camera and Application in the Diagnosis of Electrical Equipment.
IEEE Trans. Instrum. Meas., 2021

A Correlation Between Electric Fields That Target the Cell Membrane Potential and Dividing HeLa Cancer Cell Growth Inhibition.
IEEE Trans. Biomed. Eng., 2021

2020
A Theoretical Study on the Biophysical Mechanisms by Which Tumor Treating Fields Affect Tumor Cells During Mitosis.
IEEE Trans. Biomed. Eng., 2020

Space Charge Transport Characteristic Considering the Non-Uniform Electric Effect of Ion Mobility.
IEEE Access, 2020

Temperature Analysis Based on Multi-Coupling Field and Ampacity Optimization Calculation of Shore Power Cable Considering Tide Effect.
IEEE Access, 2020

Deep Compressive Single Pixel Imaging by Reordering Hadamard Basis: A Comparative Study.
IEEE Access, 2020

A Diagnosis of Grounding Grid Corrosion Defects Based on Branch Voltage Disturbance.
IEEE Access, 2020

2019
Investigation on the Thermal Performance of a 363 kV Vacuum Circuit Breaker Using a 3D Coupled Model.
IEEE Access, 2019

Design of Ultra-Wide Band Metal-Mountable Antenna for UHF Partial Discharge Detection.
IEEE Access, 2019

Investigation on Deposition Behavior of HVDC Water Cooling System Based on Electro-Mass Transfer-Velocity Coupling Model.
IEEE Access, 2019

2018
Thermal lifetime estimation method of IGBT module considering solder fatigue damage feedback loop.
Microelectron. Reliab., 2018


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