Fengshun Wu

According to our database¹, Fengshun Wu authored at least 2 papers between 2015 and 2018.

Collaborative distances:

Dijkstra number² of six.
Erdős number³ of five.

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PhD thesis

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Bibliography

2018

Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing.

[BibT_eX]

[DOI]

Ze Zhu

Yan-Cheong Chan

Fengshun Wu

Microelectron. Reliab., 2018

2015

Effect of nano Al<sub>2</sub>O<sub>3</sub> particles doping on electromigration and mechanical properties of Sn-58Bi solder joints.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2015

Fengshun Wu

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