Yan Cheong Chan

According to our database, Yan Cheong Chan authored at least 6 papers between 2002 and 2004.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2004

Dynamic strength of anisotropic conductive joints in flip chip on glass and flip chip on flex packages.

Y. P. Wu, M. O. Alam, Yan Cheong Chan, B. Y. Wu

Microelectron. Reliab., 2004

Adhesion strength and contact resistance of flip chip on flex packages--effect of curing degree of anisotropic conductive film.

M. A. Uddin, M. O. Alam, Yan Cheong Chan, H. P. Chan

Microelectron. Reliab., 2004

2003

Contact resistance and adhesion performance of ACF interconnections to aluminum metallization.

J. H. Zhang, Yan Cheong Chan, M. O. Alam, S. Fu

Microelectron. Reliab., 2003

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu

Microelectron. Reliab., 2003

Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy.

M. N. Islam, Yan Cheong Chan, Ahmed Sharif, M. O. Alam

Microelectron. Reliab., 2003

2002

Reliability study of the electroless Ni-P layer against solder alloy.

M. O. Alam, Yan Cheong Chan, K. C. Hung

Microelectron. Reliab., 2002