Fengze Hou

According to our database, Fengze Hou authored at least 4 papers between 2016 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

PDN analysis of 3D chiplet integration with a DC-DC converter on active interposer.

Chengyi Liao, Huimin He, Fengze Hou, Cheng Peng, Fengman Liu, Liqiang Cao

IEICE Electron. Express, 2025

2017

Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling.

Delong Qiu, Liqiang Cao, Qidong Wang, Fengze Hou, Xugang Wang

Microelectron. Reliab., 2017

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.

Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2017

2016

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.

Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2016