Fengman Liu

According to our database, Fengman Liu authored at least 3 papers between 2016 and 2022.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2022

Design of a PAM-4 VCSEL-Based Transceiver Front-End for Beyond-400G Short-Reach Optical Interconnects.

Jian He, Donglai Lu, Haiyun Xue, Sikai Chen, Han Liu, Leliang Li, Guike Li, Zhao Zhang, Jian Liu, Liyuan Liu, Nanjian Wu, Ningmei Yu, Fengman Liu, Xi Xiao, Yong Chen, Nan Qi

IEEE Trans. Circuits Syst. I Regul. Pap., 2022

2017

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate.

Cheng Chen, Fengze Hou, Fengman Liu, Qian She, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2017

2016

Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate.

Peng Wu, Fengze Hou, Cheng Chen, Jun Li, Fengman Liu, Jing Zhang, Liqiang Cao, Lixi Wan

Microelectron. Reliab., 2016