Frank Niklaus

According to our database, Frank Niklaus authored at least 9 papers between 2016 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Measurement and Analysis of Dynamic Energy Consumption in Microelectromechanical Relays.

Qi Tang, Elliott Worsey, Mukesh Kumar Kulsreshath, Yue Fan, Yingying Li, Simon J. Bleiker, Harold Chong, Frank Niklaus, Dinesh Pamunuwa

Proceedings of the IEEE International Symposium on Circuits and Systems, 2025

2022

Graphene waveguide-integrated thermal infrared emitter.

Nour Negm, Sarah Zayouna, Shayan Parhizkar, Pen-Sheng Lin, Po-Han Huang, Stephan Suckow, Stephan Schröder, Eleonora De Luca, Floria Ottonello Briano, Arne Quellmalz, Frank Niklaus, Kristinn B. Gylfason, Max Christian Lemme

Proceedings of the Device Research Conference, 2022

2021

NEMS Sensors Based on Suspended Graphene.

Xuge Fan, Frank Niklaus

Proceedings of the 16th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2021

2019

Carbon-Based Electrode Materials for Microsupercapacitors in Self-Powering Sensor Networks: Present and Future Development.

A. Smith, Qi Li, Agin Vyas, Mohammad Haque, Kejian Wang, Andres Velasco, Xiaoyan Zhang, Shameel Thurakkal, Arne Quellmalz, Frank Niklaus, Kristinn Gylfason, Per Lundgren, Peter Enoksson

Sensors, 2019

Silicon Photonic MEMS: Exploiting Mechanics at the Nanoscale to Enhance Photonic Integrated Circuits.

Niels Quack, Hamed Sattari, Alain Y. Takabayashi, Yu Zhang, Pierre Edinger, Carlos Errando-Herranz, Kristinn B. Gylfason, Xiaojing Wang, Frank Niklaus, Moises A. Jezzini, How Yuan Hwang, Peter O'Brien, Marco A. G. Porcel, Cristina Lerma Arce, Saurav Kumar, Banafsheh Abasahl, Peter Verheyen, Wim Bogaerts

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019

2018

Performance Analysis of Nanoelectromechanical Relay-Based Field-Programmable Gate Arrays.

Tian Qin, Simon J. Bleiker, Sunil Rana, Frank Niklaus, Dinesh Pamunuwa

IEEE Access, 2018

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires.

Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Göran Stemme, Thorbjorn Ebefors, Frank Niklaus

IEEE Access, 2018

2016

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding.

Simon J. Bleiker, Maaike M. Visser Taklo, Nicolas Lietaer, Andreas Vogl, Thor Bakke, Frank Niklaus

Micromachines, 2016

Toward effective passivation of graphene to humidity sensing effects.

Anderson D. Smith, Karim Elgammal, Xuge Fan, Max Christian Lemme, Anna Delin, Frank Niklaus, Mikael Östling

Proceedings of the 46th European Solid-State Device Research Conference, 2016