Gerhard K. M. Wachutka

Orcid: 0000-0002-7328-4169

According to our database1, Gerhard K. M. Wachutka authored at least 14 papers between 1990 and 2023.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

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Bibliography

2023
High-Throughput Apparatus for Semiconductor Device Characterization in a Magnetic Field at Extreme High Temperatures.
IEEE Trans. Instrum. Meas., 2023

2017
Transient analysis of latent damage formation in SMD capacitors by Transmission Line Pulsing (TLP).
Microelectron. Reliab., 2017

2013
Evaluation of thermal transient characterization methodologies for high-power LED applications.
Microelectron. J., 2013

The art of modeling and predictive simulation in power electronics and microsystems.
Proceedings of the 20th International Conference Mixed Design of Integrated Circuits and Systems, 2013

2009
Combination of thermal subsystems by use of rapid circuit transformation and extended two-port theory.
Microelectron. J., 2009

2008
Testing semiconductor devices at extremely high operating temperatures.
Microelectron. Reliab., 2008

Virtual Prototyping of Microdevices and Microsystems.
Proceedings of the Distributed Intelligent Systems and Technologies Workshop, 2008

2006
Thermal characterisation of power devices during transient operation.
Microelectron. J., 2006

2004
Corrections to "Physically Rigorous Modeling of Internal Laser-Probing Techniques for Microstructured Semiconductor Devices".
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004

Physically rigorous modeling of internal laser-probing techniques for microstructured semiconductor devices.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2004

Reliability of power electronic devices against cosmic radiation-induced failure.
Microelectron. Reliab., 2004

2003
Avalanche breakdown capability of Power DMOS Transistors and the Wunsch-Bell relation.
Microelectron. Reliab., 2003

1994
Nonisothermal device simulation using the 2D numerical process/device simulator TRENDY and application to SOI-devices.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1994

1990
Rigorous thermodynamic treatment of heat generation and conduction in semiconductor device modeling.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1990


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