Guangbao Shan

Orcid: 0000-0002-9268-4870

According to our database¹, Guangbao Shan authored at least 6 papers between 2016 and 2026.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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Book In proceedings Article PhD thesis Dataset Other

Links

On csauthors.net:

Bibliography

2026

An electrical-thermal coupling model of multilayer HTCC substrate vias considering temperature variation parameters.

[BibT_eX]

[DOI]

Microelectron. J., 2026

2025

An intelligent thermo-mechanical coupling collaborative design technique for 2.5D chiplet heterogeneous integration (CHI) system.

[BibT_eX]

[DOI]

Microelectron. J., 2025

A DC-5 GHz TSV-Based 3-D Network for Multichiplet Wireless System Reconfiguration.

[BibT_eX]

[DOI]

IEEE Internet Things J., 2025

2024

A wafer-level 3D integrated T/R microsystem with 0.5-wavelength self-matching connectors.

[BibT_eX]

[DOI]

Microelectron. J., 2024

2022

A Fast Analysis Method of Multiphysics Coupling for 3-D Microsystem.

[BibT_eX]

[DOI]

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

2016

High-performance processor design based on 3D on-chip cache.

[BibT_eX]

[DOI]

Microprocess. Microsystems, 2016

Guangbao Shan

Timeline

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Links

On csauthors.net:

Bibliography

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