Hakim Zimouche

According to our database1, Hakim Zimouche authored at least 4 papers between 2010 and 2014.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2014
Built-in self-test for manufacturing TSV defects before bonding.
Proceedings of the 32nd IEEE VLSI Test Symposium, 2014

2013
A BIST method for TSVs pre-bond test.
Proceedings of the 8th International Design and Test Symposium, 2013

2011
An improved smart readout technique based on temporal redundancies suppression designed for logarithmic CMOS image sensor.
Proceedings of the 18th IEEE International Conference on Electronics, Circuits and Systems, 2011

2010
Temperature compensation method for logarithmic CMOS vision sensor using CMOS voltage reference Bandgap technique.
Proceedings of the 17th IEEE International Conference on Electronics, 2010


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