Hervé Jaouen

According to our database, Hervé Jaouen authored at least 3 papers between 2013 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2014

Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies.

Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier

Microelectron. Reliab., 2014

The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies.

Frederic Monsieur, Y. Denis, Denis Rideau, V. Quenette, Gilles Gouget, Clément Tavernier, Hervé Jaouen, Gérard Ghibaudo, Joris Lacord

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond.

Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier

Microelectron. Reliab., 2013