Clément Tavernier

According to our database, Clément Tavernier authored at least 8 papers between 2013 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of three.

2016

Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs.

Giacomo Garegnani, Vincent Fiori, Gilles Gouget, Frederic Monsieur, Clément Tavernier

Microelectron. Reliab., 2016

2015

Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test.

Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier

Microelectron. Reliab., 2015

2014

Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies.

Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier

Microelectron. Reliab., 2014

Laser-induced fault effects in security-dedicated circuits.

Régis Leveugle, Paolo Maistri, Pierre Vanhauwaert, Feng Lu, Giorgio Di Natale, Marie-Lise Flottes, Bruno Rouzeyre, Athanasios Papadimitriou, David Hély, Vincent Beroulle, Guillaume Hubert, Stephan De Castro, Jean-Max Dutertre, Alexandre Sarafianos, Noemie Boher, Mathieu Lisart, Joel Damiens, Philippe Candelier, Clément Tavernier

Proceedings of the 22nd International Conference on Very Large Scale Integration, 2014

Laser-Induced Fault Effects in Security-Dedicated Circuits.

Vincent Beroulle, Philippe Candelier, Stephan De Castro, Giorgio Di Natale, Jean-Max Dutertre, Marie-Lise Flottes, David Hély, Guillaume Hubert, Régis Leveugle, Feng Lu, Paolo Maistri, Athanasios Papadimitriou, Bruno Rouzeyre, Clément Tavernier, Pierre Vanhauwaert

Proceedings of the VLSI-SoC: Internet of Things Foundations, 2014

The importance of the spacer region to explain short channels mobility collapse in 28nm Bulk and FDSOI technologies.

Frederic Monsieur, Y. Denis, Denis Rideau, V. Quenette, Gilles Gouget, Clément Tavernier, Hervé Jaouen, Gérard Ghibaudo, Joris Lacord

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond.

Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier

Microelectron. Reliab., 2013

Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013