Kuo-Ming Chen

According to our database, Kuo-Ming Chen authored at least 11 papers between 2003 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Machine Learning Based Automatic Diagnosis in Mobile Communication Networks.

Kuo-Ming Chen, Tsung-Hui Chang, Kai-Cheng Wang, Ta-Sung Lee

IEEE Trans. Veh. Technol., 2019

Lifetime Maximization for Uplink Transmission in UAV-Enabled Wireless Networks.

Kuo-Ming Chen, Tsung-Hui Chang, Ta-Sung Lee

Proceedings of the 2019 IEEE Wireless Communications and Networking Conference, 2019

2018

Low-Complexity Beam Selection for Hybrid Precoded Multi-User mmWave Communications.

Kuo-Ming Chen, Yun-Han Pan, Ta-Sung Lee

Proceedings of the 2018 IEEE International Conference on Signal Processing, 2018

2015

Energy-Efficient Deterministic Adaptive Beamforming Algorithms for Distributed Sensor/Relay Networks.

Chun-Wei Li, Kuo-Ming Chen, Po-Chun Fu, Wei-Ning Chen, Che Lin

CoRR, 2015

2011

Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology.

Hsien-Chie Cheng, Kun-Yu Hsieh, Kuo-Ming Chen

Microelectron. Reliab., 2011

2007

Electromigration of Sn-37Pb and Sn-3Ag-1.5Cu/Sn-3Ag-0.5Cu composite flip-chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy.

Yi-Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Microelectron. Reliab., 2007

A longest prefix first search tree for IP lookup.

Lih-Chyau Wuu, Tzong-Jye Liu, Kuo-Ming Chen

Comput. Networks, 2007

2006

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.

Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang

Microelectron. Reliab., 2006

Thermal resistance analysis and validation of flip chip PBGA packages.

Kuo-Ming Chen, Kuo-Hsiung Houng, Kuo-Ning Chiang

Microelectron. Reliab., 2006

2004

Reconstruction and Fusion of Multi-modality Spinal Images.

Kuo-Ming Chen, Yuan-Tsung Chen, Ming-Shi Wang

Proceedings of the International Conference on Imaging Science, Systems and Technology, 2004

2003

Impact of probing procedure on flip chip reliability.

Kuo-Ming Chen, Kuo-Ning Chiang

Microelectron. Reliab., 2003