J. S. Hwang

According to our database1, J. S. Hwang authored at least 5 papers between 1992 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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PhD thesis 
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Links

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Bibliography

2012
Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding.
Microelectron. Reliab., 2012

2008
Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application.
Microelectron. Reliab., 2008

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs.
Microelectron. Reliab., 2008

1999
Rational approximation to orthogonal bases and of the solutions of elliptic equations.
Numerische Mathematik, 1999

1992
Interference-free tool-path generation in the NC machining of parametric compound surfaces.
Comput. Aided Des., 1992


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