J. T. Moon

According to our database, J. T. Moon authored at least 7 papers between 2009 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding.

Alireza Rezvani, Aashish Shah, M. Mayer, Norman Y. Zhou, J. T. Moon

Microelectron. Reliab., 2013

2012

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding.

Wan Ho Song, Michael Mayer, Norman Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon

Microelectron. Reliab., 2012

2011

Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding.

Aashish Shah, Alireza Rezvani, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding.

A. Pequegnat, H. J. Kim, M. Mayer, Norman Y. Zhou, John Persic, J. T. Moon

Microelectron. Reliab., 2011

Influence of gold pick up on the hardness of copper free air ball.

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, J. T. Moon, John Persic

Microelectron. Reliab., 2011

Silver pick up during tail formation in thermosonic wire bonding process.

Jae-sik Lee, Michael Mayer, Norman Y. Zhou, S. J. Hong, J. T. Moon

Microelectron. Reliab., 2011

2009

Measuring stress next to Au ball bond during high temperature aging.

M. Mayer, J. T. Moon, John Persic

Microelectron. Reliab., 2009