Jae Hak Lee

According to our database1, Jae Hak Lee authored at least 5 papers between 2008 and 2013.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2013
High reliability insert-bump bonding process for 3D integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A study on wafer level TSV build-up integration method.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
A study on the edge traces technique for 3D stack chip.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
Robust CCD and IR Image Registration Using Gradient-Based Statistical Information.
IEEE Signal Process. Lett., 2010

2008
Multi-sensor image registration based on intensity and edge orientation information.
Pattern Recognit., 2008


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