Jun-Yeob Song

According to our database1, Jun-Yeob Song authored at least 5 papers between 2010 and 2013.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2013
High reliability insert-bump bonding process for 3D integration.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A study on wafer level TSV build-up integration method.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011
A study on the edge traces technique for 3D stack chip.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
A Study on Effective System for Harbor Container Delivery & Cargo Work Automatuion.
Wirel. Sens. Netw., 2010

An Auto-Configuration of 4M Group Management Using Wireless Sensor Networks.
Wirel. Sens. Netw., 2010


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