Tae Ho Ha

According to our database, Tae Ho Ha authored at least 3 papers between 2004 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

High reliability insert-bump bonding process for 3D integration.

Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A study on wafer level TSV build-up integration method.

Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2004

Automatic 3D-Laser Scattering Measurement for Ultra-Finished Surface with Nanowatt Sensitivity.

Tae Ho Ha, Keiichi Kimura, Takashi Miyoshi, Yasuhiro Takaya

J. Robotics Mechatronics, 2004