James Vandersand
  According to our database1,
  James Vandersand
  authored at least 4 papers
  between 2005 and 2025.
  
  
Collaborative distances:
Collaborative distances:
Timeline
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Bibliography
  2025
A 0.29pJ/b 5.27Tb/s/mm UCIe Advanced Package Link in 3nm FinFET with 2.5D CoWoS Packaging.
    
  
    Proceedings of the IEEE International Solid-State Circuits Conference, 2025
    
  
  2023
Short to Medium-Reach Wireline Transceivers Using Single-Ended Signaling, Clock Forwarding, and Spatial Encoding for Die-to-Die Applications.
    
  
    Proceedings of the IEEE Custom Integrated Circuits Conference, 2023
    
  
  2021
A 480Gb/s/mm 1.7pJ/b Short-Reach Wireline Transceiver Using Single-Ended NRZ for Die-to-Die Applications.
    
  
    Proceedings of the IEEE International Solid-State Circuits Conference, 2021
    
  
  2005
    Proceedings of the 31st European Solid-State Circuits Conference, 2005