Jeongmin Shin
Orcid: 0009-0002-8049-3708
According to our database1,
Jeongmin Shin
authored at least 16 papers
between 2021 and 2025.
Collaborative distances:
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Bibliography
2025
C<sup>2</sup>IM-NN: A Low-Power 3D Point Clouds Matching Processor With 1D-CNN Prediction and CAM-Based In-Memory k-NN Searching.
IEEE Trans. Circuits Syst. I Regul. Pap., July, 2025
Boosting Cross-spectral Unsupervised Domain Adaptation for Thermal Semantic Segmentation.
CoRR, May, 2025
A 701.7 TOPS/W Compute-in-Memory Processor With Time-Domain Computing for Spiking Neural Network.
IEEE Trans. Circuits Syst. I Regul. Pap., January, 2025
IEEE J. Solid State Circuits, January, 2025
A Mobile Semantic Lidar SLAM Processor With Artificial-Intelligence-Based 3-D Perception and Spatiotemporal-Aware Computing.
IEEE Micro, 2025
2024
INSANet: INtra-INter Spectral Attention Network for Effective Feature Fusion of Multispectral Pedestrian Detection.
Sensors, February, 2024
20.6 LSPU: A Fully Integrated Real-Time LiDAR-SLAM SoC with Point-Neural-Network Segmentation and Multi-Level kNN Acceleration.
Proceedings of the IEEE International Solid-State Circuits Conference, 2024
Data Augmentation Techniques Using Text-to-Image Diffusion Models for Enhanced Data Diversity.
Proceedings of the 15th International Conference on Information and Communication Technology Convergence, 2024
LSPU: A 20.7 ms Low-Latency Point Neural Network-Based 3D Perception and Semantic LiDAR SLAM System-on-Chip for Autonomous Driving System.
Proceedings of the 36th IEEE Hot Chips Symposium, 2024
A Low-power and Real-time Semantic LiDAR SLAM Processor with Point Neural Network Segmentation and kNN Acceleration for Mobile Robots.
Proceedings of the IEEE Symposium in Low-Power and High-Speed Chips, 2024
A 273.48 TOPS/W and 1.58 Mb/mm<sup>2</sup> Analog-Digital Hybrid CIM Processor with Transpose Ternary-eDRAM Bitcell.
Proceedings of the IEEE Asian Solid-State Circuits Conference, 2024
A Low-power 3D Point Clouds Matching Processor with 1D-CNN Prediction and CAM-based In-memory kNN Searching.
Proceedings of the 6th IEEE International Conference on AI Circuits and Systems, 2024
2022
Sensors, 2022
IEEE Robotics Autom. Lett., 2022
2021
Proceedings of the 18th International Conference on Ubiquitous Robots, 2021