Jun-Yeob Song

According to our database, Jun-Yeob Song authored at least 5 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2013

High reliability insert-bump bonding process for 3D integration.

Jun-Yeob Song, Jae Hak Lee, Hyoung Joon Kim, Chang Woo Lee, Tae Ho Ha

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

A study on wafer level TSV build-up integration method.

Jae Hak Lee, Hyoung Joon Kim, Jun-Yeob Song, Chang Woo Lee, Tae Ho Ha

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

A study on the edge traces technique for 3D stack chip.

Jae Hak Lee, Choong D. Yoo, Jun-Yeob Song, Seung S. Lee, Sun-Rak Kim

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

A Study on Effective System for Harbor Container Delivery & Cargo Work Automatuion.

Dong-Hoon Kim, Jun-Yeob Song, Seung-Ho Lee, Il-Yong Kang, Suk-Keun Cha

Wirel. Sens. Netw., 2010

An Auto-Configuration of 4M Group Management Using Wireless Sensor Networks.

Suk-Keun Cha, Jeong-Hoon Lee, Han Gyu Kim, Joon Jae Yoo, Jung Hoon Kang, Dong Hoon Kim, Jun-Yeob Song

Wirel. Sens. Netw., 2010