Junping Zheng

According to our database, Junping Zheng authored at least 5 papers between 2015 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Universal closed-form expression based on magnetic flux density for the inductance of Tapered Through-Silicon Vias (T-TSVs).

Zheng Mei, Gang Dong, Yintang Yang, Junping Zheng, Jingrui Chai, Weijun Zhu

Microelectron. J., 2017

2016

New coaxial through silicon via (TSV) applied for three dimensional integrated circuits (3D ICs).

Yintang Yang, Junping Zheng, Gang Dong, Yingbo Zhao, Zheng Mei, Weijun Zhu

IEICE Electron. Express, 2016

Universal closed-form expressions for the inductance of tapered through silicon vias (T-TSVs) based on vector magnetic potential.

Zheng Mei, Gang Dong, Yintang Yang, Junping Zheng, Yingbo Zhao, Weijun Zhu

IEICE Electron. Express, 2016

2015

Electrical analysis of TSV step change in radius with compensation structure.

Junping Zheng, Gang Dong, Yintang Yang, Yingbo Zhao, Qingyang Fan

IEICE Electron. Express, 2015

Analysis and evaluation of coupling between adjacent TSVs with considering the discharging path.

Yingbo Zhao, Gang Dong, Yintang Yang, Junping Zheng

IEICE Electron. Express, 2015