Junsoo Kim
Orcid: 0000-0001-6680-2602Affiliations:
- Korea Advanced Institute of Science and Technology, Daejeon, South Korea
According to our database1,
Junsoo Kim
authored at least 10 papers
between 2022 and 2024.
Collaborative distances:
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Bibliography
2024
EPU: An Energy-Efficient Explainable AI Accelerator With Sparsity-Free Computation and Heat Map Compression/Pruning.
IEEE J. Solid State Circuits, March, 2024
2023
T-PIM: An Energy-Efficient Processing-in-Memory Accelerator for End-to-End On-Device Training.
IEEE J. Solid State Circuits, March, 2023
HyperAccel Latency Processing Unit (LPU<sup>TM</sup>) Accelerating Hyperscale Models for Generative AI.
Proceedings of the 35th IEEE Hot Chips Symposium, 2023
A 26.55TOPS/W Explainable AI Processor with Dynamic Workload Allocation and Heat Map Compression/Pruning.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2023
2022
Design of Processing-in-Memory With Triple Computational Path and Sparsity Handling for Energy-Efficient DNN Training.
IEEE J. Emerg. Sel. Topics Circuits Syst., 2022
OpenMDS: An Open-Source Shell Generation Framework for High-Performance Design on Xilinx Multi-Die FPGAs.
IEEE Comput. Archit. Lett., 2022
Federated Onboard-Ground Station Computing With Weakly Supervised Cascading Pyramid Attention Network for Satellite Image Analysis.
IEEE Access, 2022
DFX: A Low-latency Multi-FPGA Appliance for Accelerating Transformer-based Text Generation.
Proceedings of the 2022 IEEE Hot Chips 34 Symposium, 2022
OpenMDS: An Open-Source Shell Generation Framework for High-Performance Design on Multi-Die FPGAs.
Proceedings of the 30th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2022
T-PIM: A 2.21-to-161.08TOPS/W Processing-In-Memory Accelerator for End-to-End On-Device Training.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2022