Jürgen Auersperg

According to our database, Jürgen Auersperg authored at least 4 papers between 2014 and 2018.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2018

Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor.

Jürgen Auersperg, Ellen Auerswald, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler, Sven Rzepka

Microelectron. Reliab., 2018

2016

Effects of residual stresses on cracking and delamination risks of an avionics MEMS pressure sensor.

Jürgen Auersperg, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler

Microelectron. Reliab., 2016

2014

Stress analyses of high spatial resolution on TSV and BEoL structures.

Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014

On the crack and delamination risk optimization of a Si-interposer for LED packaging.

Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014