Sven Rzepka

According to our database, Sven Rzepka authored at least 12 papers between 2004 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters.

Giovanni Di Nuzzo, Horst Lewitschnig, Marc Tuellmann, Sven Rzepka, Alexander Otto

Proceedings of the IEEE International Conference on Prognostics and Health Management, 2023

2021

The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0).

Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Müjdat Soytürk, Luigi Pomante

Proceedings of the 24th Euromicro Conference on Digital System Design, 2021

2018

Reliability testing of integrated low-temperature PVD PZT films.

Daniel Monteiro Diniz Reis, Sven Rzepka, Karla Hiller

Microelectron. Reliab., 2018

Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue.

Rainer Dudek, M. Hildebrand, Sven Rzepka, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann

Microelectron. Reliab., 2018

Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor.

Jürgen Auersperg, Ellen Auerswald, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler, Sven Rzepka

Microelectron. Reliab., 2018

2016

Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments.

Dietmar Vogel, Ellen Auerswald, Gh. Gadhiya, Sven Rzepka

Microelectron. Reliab., 2016

An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.

Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle

Microelectron. Reliab., 2016

2014

Stress analyses of high spatial resolution on TSV and BEoL structures.

Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014

Stress impact of moisture diffusion measured with the stress chip.

F. Schindler-Saefkow, F. Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, J. Keller

Microelectron. Reliab., 2014

On the crack and delamination risk optimization of a Si-interposer for LED packaging.

Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2014

2013

Effect of moisture swelling on MEMS packaging and integrated sensors.

J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel

Microelectron. Reliab., 2013

2004

Time-independent elastic-plastic behaviour of solder materials.

Steffen Wiese, Sven Rzepka

Microelectron. Reliab., 2004