O. Bochow-Neß

According to our database1, O. Bochow-Neß authored at least 1 paper in 2014.

Collaborative distances:
  • Dijkstra number2 of six.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2014
On the crack and delamination risk optimization of a Si-interposer for LED packaging.
Microelectron. Reliab., 2014


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