K. H. Chua

According to our database, K. H. Chua authored at least 6 papers between 2002 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

Analysis on the Employability Skills of UNITEN Graduates in Engineering Program.

A. R. Fadhilah, M. N. Noraini, A. M. Noreliza, K. H. Chua

Proceedings of the IEEE 10th International Conference on Engineering Education, 2018

2005

New encapsulation development for fine pitch IC devices.

Y. F. Yao, B. Njoman, K. H. Chua, T. Y. Lin

Microelectron. Reliab., 2005

2004

The impact of moisture in mold compound preforms on the warpage of PBGA packages.

T. Y. Lin, B. Njoman, D. Crouthamel, K. H. Chua, S. Y. Teo, Y. Y. Ma

Microelectron. Reliab., 2004

2003

Improving the deflection of wire bonds in stacked chip scale package (CSP).

Y. F. Yao, T. Y. Lin, K. H. Chua

Microelectron. Reliab., 2003

Development of the green plastic encapsulation for high density wirebonded leaded packages.

T. Y. Lin, C. M. Fang, Y. F. Yao, K. H. Chua

Microelectron. Reliab., 2003

2002

The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.

T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai

Microelectron. Reliab., 2002