K. K. Jinka

According to our database, K. K. Jinka authored at least 2 papers between 2007 and 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2009

Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.

K. K. Jinka, A. Dasgupta, S. Ganesan, S. Ling

Microelectron. Reliab., 2009

2007

Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips.

K. K. Jinka, S. Ganesan, A. Dasgupta, S. Ling, Andrew A. Shapiro, D. Schatzel

Microelectron. Reliab., 2007