S. Ling

According to our database, S. Ling authored at least 3 papers between 2005 and 2009.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of three.

2009

Chip-on board technology for low temperature environment. Part II: Thermomechanical stresses in encapsulated ball-wedge bond wires.

K. K. Jinka, A. Dasgupta, S. Ganesan, S. Ling

Microelectron. Reliab., 2009

2007

Chip-on-Board (CoB) technology for low temperature environments. Part I: Wire profile modeling in unencapsulated chips.

K. K. Jinka, S. Ganesan, A. Dasgupta, S. Ling, Andrew A. Shapiro, D. Schatzel

Microelectron. Reliab., 2007

2005

The Biomolecular Interaction Network Database and related tools 2005 update.

C. Alfarano, C. E. Andrade, K. Anthony, N. Bahroos, Martha Bajec, K. Bantoft, Doron Betel, B. Bobechko, K. Boutilier, E. Burgess, K. Buzadzija, R. Cavero, C. D'Abreo, Ian M. Donaldson, D. Dorairajoo, Michel Justin Dumontier, M. R. Dumontier, V. Earles, R. Farrall, Howard J. Feldman, E. Garderman, Y. Gong, R. Gonzaga, V. Grytsan, E. Gryz, V. Gu, E. Haldorsen, A. Halupa, Robin Haw, A. Hrvojic, L. Hurrell, Ruth Isserlin, F. Jack, F. Juma, A. Khan, T. Kon, S. Konopinsky, V. Le, E. Lee, S. Ling, M. Magidin, J. Moniakis, J. Montojo, S. Moore, B. Muskat, I. Ng, J. P. Paraiso, Benjamin D. Parker, Greg Pintilie, R. Pirone, John J. Salama, S. Sgro, T. Shan, Y. Shu, J. Siew, D. Skinner, Kevin A. Snyder, R. Stasiuk, D. Strumpf, Brigitte Tuekam, S. Tao, Z. Wang, M. White, R. Willis, Cheryl Wolting, S. Wong, A. Wrong, C. Xin, R. Yao, B. Yates, Shudong Zhang, K. Zheng, Tony Pawson, B. F. Francis Ouellette, Christopher W. V. Hogue

Nucleic Acids Res., 2005