Karl-Reinhard Merkel

According to our database, Karl-Reinhard Merkel authored at least 3 papers between 2010 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2016

3D TSV based high frequency components for RF IC and RF MEMS applications.

Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2010

Silicon-interposer with high density Cu-filled TSVs.

Robert Wieland, Kai Zoschke, Nils Jurgensen, Karl-Reinhard Merkel, Lars Nebrich, Jürgen Wolf

Proceedings of the IEEE International Conference on 3D System Integration, 2010

Application of the SLID-ICV interconnection technology for the ATLAS pixel upgrade at SLHC.

Ladislav Andricek, Michael Beimforde, Armin Klumpp, Anna Macchiolo, Karl-Reinhard Merkel, Hans-Günther Moser, Richard Nisius, Rainer Helmut Richter, Josef Weber, Philipp Weigell, Robert Wieland

Proceedings of the IEEE International Conference on 3D System Integration, 2010