Peter Ramm

According to our database, Peter Ramm authored at least 9 papers between 2008 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Energy Autonomous Wearable Sensors for Smart Healthcare: A Review.

Abhishek Singh Dahiya, Jerome Thireau, Jamila Boudaden, Swatchith Lal, Umair Gulzar, Yan Zhang, Thierry Gil, Nadine Azémard, Peter Ramm, Tim Kiessling, Cian O'Murchu, Fredrik Sebelius, Jonas Tilly, Colm Glynn, Shane Geary, Colm O'Dwyer, Kafil Razeeb, Alain Lacampagne, Benoît Charlot, Aida Todri-Sanial

CoRR, 2019

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration.

Peter Ramm, Armin Klumpp, Christof Landesberger, Josef Weber, Andy Heinig, Peter Schneider, Günter Elst, Manfred Engelhardt

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2016

3D TSV based high frequency components for RF IC and RF MEMS applications.

Montserrat Fernandez-Bolaños, Wolfgang A. Vitale, Mariazel Maqueda Lopez, Adrian M. Ionescu, Armin Klumpp, Karl-Reinhard Merkel, Josef Weber, Peter Ramm, Ilja Ocket, Walter De Raedt, Amin Enayati

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Current and future 3D activities at Fraunhofer.

Andy Heinig, Muhammad Waqas Chaudhary, Peter Schneider, Peter Ramm, Josef Weber

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2010

3D Integration technology: Status and application development.

Peter Ramm, Armin Klumpp, Josef Weber, Nicolas Lietaer, Maaike Taklo, Walter De Raedt, Thomas Fritzsch, Pascal Couderc

Proceedings of the 36th European Solid-State Circuits Conference, 2010

3D-integration of silicon devices: A key technology for sophisticated products.

Armin Klumpp, Peter Ramm, Robert Wieland

Proceedings of the Design, Automation and Test in Europe, 2010

High performance 3D interconnects based on electrochemical etch and liquid metal fill.

Harry Hedler, Thomas Scheiter, Markus Schieber, Armin Klumpp, Peter Ramm

Proceedings of the IEEE International Conference on 3D System Integration, 2010

2008

Through Silicon Vias as Enablers for 3D Systems

E. Jung, Andreas Ostmann, Peter Ramm, Jürgen Wolf, Michael Toepper, Maik Wiemer

CoRR, 2008

Technologies for 3D Heterogeneous Integration

Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl

CoRR, 2008