Karsten Meier

According to our database, Karsten Meier authored at least 4 papers between 2018 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Compensation of thermal drifts on MEMS Inertial Measurement Unit using package underfilling.

Gabriele Patrizi, Marco Carratù, Karsten Meier, Paolo Sommella, Antonio Pietrosanto, Karlheinz Bock, Lorenzo Ciani

Proceedings of the IEEE International Instrumentation and Measurement Technology Conference, 2025

2023

Wafer Level Chip Scale Package Failure Mode Prediction using Finite Element Modeling.

Viktor Dudash, Kashi Vishwanath Machani, Bjoern Boehme, Simone Capecchi, Jungtae Ok, Karsten Meier, Frank Kuechenmeister, Marcel Wieland, Karlheinz Bock

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2020

Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor.

Simon Schlipf, André Clausner, Jens Paul, Simone Capecchi, Laura Wambera, Karsten Meier, Ehrenfried Zschech

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018

Experimental determination of the Young's modulus of copper and solder materials for electronic packaging.

Frank Kraemer, Mike Roellig, René Metasch, Joseph Al Ahmar, Karsten Meier, Steffen Wiese

Microelectron. Reliab., 2018