André Clausner

According to our database, André Clausner authored at least 6 papers between 2014 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.

Zhenjun Zhang, Matthias Kraatz, Meike Hauschildt, Seungman Choi, André Clausner, Ehrenfried Zschech, Martin Gall

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor.

Simon Schlipf, André Clausner, Jens Paul, Simone Capecchi, Laura Wambera, Karsten Meier, Ehrenfried Zschech

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2018

Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling.

M. Kraatz, Christoph Sander, André Clausner, M. Hauschildt, Yvonne Standke, Martin Gall, Ehrenfried Zschech

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation.

André Clausner, Simon Schlipf, Gottfried Kurz, Michael Otto, Jens Paul, Kay-Uwe Giering, Jens Warmuth, André Lange, Roland Jancke, Andreas Aal, Rüdiger Rosenkranz, Martin Gall, Ehrenfried Zschech

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments.

Jens Warmuth, Kay-Uwe Giering, André Lange, André Clausner, Simon Schlipf, Gottfried Kurz, Michael Otto, Jens Paul, Roland Jancke, Andreas Aal, Martin Gall, Ehrenfried Zschech

Proceedings of the 48th European Solid-State Device Research Conference, 2018

2014

Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration.

Christoph Sander, Yvonne Standke, Sven Niese, Rüdiger Rosenkranz, André Clausner, Martin Gall, Ehrenfried Zschech

Microelectron. Reliab., 2014