Ehrenfried Zschech
According to our database1,
Ehrenfried Zschech
authored at least 8 papers
between 2012 and 2021.
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Bibliography
2021
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects.
Proceedings of the IEEE International Reliability Physics Symposium, 2021
2020
Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
2018
Analysis of electromigration-induced backflow stresses in Cu(Mn) interconnects using high statistical sampling.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Analysis of 28 nm SRAM cell stability under mechanical load applied by nanoindentation.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Prediction of SRAM Reliability Under Mechanical Stress Induced by Harsh En§ironments.
Proceedings of the 48th European Solid-State Device Research Conference, 2018
2016
Ga contamination in silicon by Focused Ion Beam milling: Dynamic model simulation and Atom Probe Tomography experiment.
Microelectron. Reliab., 2016
2014
Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration.
Microelectron. Reliab., 2014
2012
Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance.
J. Electron. Test., 2012